Systems are designed for laser micromachining on flexible substrates while winding these from roller to roller. It is equipped with novel machine vision solutions enabling to capture alignment marks on the fly and correct position deviations arising due to web vibrations and irregularities.
Winding speed up to 30 m/ min
High precision coating processing
Film base handling tension control
Stable continuous processing
APPLICATIONS/ Suitable for
Selective material ablation
STANDARD CONFIGURATION PARAMETERS
|Laser type||DPSS, mode-locked, ps|
|Average laser power||6-60 W|
|Max winding speed||30 m/min|
(depends on laser power)
|< 1 – 5 kW, 240 VAC, 50-60 Hz|
*custom options are available on request
MULTI-BEAM PROCESSING MODULE
Multi-Beam processing module using laser beam interference patterning technique can be used to enhance fabrication speed of periodic patterns, compared to the conventional direct laser writing. Interference patterning allows distributing irradiation energy over a large fabrication area and producing sub-wavelength features in this area with a single exposition. A laser spot containing modulated intensity can be utilized as a lithography tool or to pattern a material through laser ablation process directly.