Project Description

MASTER 1 laser micro machining workstation was originally developed for scribing of sapphire wafers. But many customisation options and optimized micromachining parameters such as pulse energy, pulse energy density, focusing conditions, etc. make it universal tool for many laser micro-processing applications.


  • Versatility in terms of materials

  • Taper controlled drilling

  • Only top – quality components

  • Intelligent laser machining software

  • Beam focus adjustment

  • Beam power (pulse energy) control

APPLICATIONS/ Suitable for

  • Scribing

  • Marking

  • Cutting

  • Drilling

  • Selective material ablation

  • Pattering, coating removal


  • Polymer

  • Glass

  • Sapphire

  • Metals

  • Ceramics

  • Synthetic diamond

  • Silicon


Laser type ps fs
Average laser power 6-60 W 4-40 W
Positioning type XYZ + galvo scanner, rotary, tilt axes etc.
Travel range 300 x 300 x 150 mm *
Positioning speed Up to 500 mm/s
Power consumption (depends on laser power) < 5 kW, 240 VAC, 50-60 Hz
Laser safety Class 1 (MPE)
Dimensions, mm (W x H x D) 1800 x 1820 x 1420

*other available on request


  • Automated Machine Vision

  • Dust and Fume Extraction

  • Samples mounting (vacuum chuck)

  • Internal vacuum generation station

  • Automated Z axis

  • Rotary axis

  • Power meter

  • Red laser beam pointer

  • Working field extension

Other options are available on request