Project Description

MASTER 1 laser micro machining workstation was originally developed for scribing of sapphire wafers. But many customisation options and optimized micromachining parameters such as pulse energy, pulse energy density, focusing conditions, etc. make it universal tool for many laser micro-processing applications.

KEY FEATURES

  • Versatility in terms of materials

  • Taper controlled drilling

  • Only top – quality components

  • Intelligent laser machining software

  • Beam focus adjustment

  • Beam power (pulse energy) control

APPLICATIONS/ Suitable for

  • Scribing

  • Marking

  • Cutting

  • Drilling

  • Selective material ablation

  • Pattering, coating removal

MATERIALS

  • Polymer

  • Glass

  • Sapphire

  • Metals

  • Ceramics

  • Synthetic diamond

  • Silicon

STANDARD CONFIGURATION PARAMETERS

Laser type DPSS, mode-locked, ps Fiber, mode-locked, fs
Average laser power 6 W 3 W
Positioning type Galvo scanner/ manual XYZ
Working field 100 x 100 mm *
Positioning speed 12 m/s
Power consumption (depends on laser power) <1 Р4 kW, 240 VAC, 50-60 Hz
Laser safety Class 1 (MPE)
Dimensions, mm (W x H x D) 520 x 650 x 950

*other available on request

OPTIONS AVAILABLE

  • Automated Machine Vision

  • Dust and Fume Extraction

  • Samples mounting (vacuum chuck)

  • Internal vacuum generation station

  • Automated Z axis

  • Rotary axis

  • Power meter

  • Red laser beam pointer

  • Working field extension

Other options are available on request