The technology can be applied for various materials processing. During the preparation stage, the 3D object drawing is divided to individual layers. Afterwards, layer by layer material ablation is introduced. The use of ultrafast laser pulses for processing ensures high processing quality and speed. Compared to nanosecond lasers, the short pulse – matter interaction time significantly reduces the thermal effects. The laser induced heat diffusion is limited at such pulse durations. Therefore, melt formation and oxidation of the surface are significantly reduced. Also burr formation is much lower compared to nanosecond laser processing. In the case of copper, 6 mm 3/min ablation rate is achieved. Materials: metals, semiconductors, ceramics, glass, polymers. 50 μm ablation precision is achieved.
