How does it work?
SSAIL is a two-step process:
1. Surface of the part is activated by laser
2. Chemical activation
2.1. Electrochemical plating
2.2. Standard chemical electroplating process
Flexibility of shapes
SSAIL technology enables forming conductive traces on different form factors:
– 3D surfaces
– Thin films
– Flexible materials
– Transparent materials
– From 1μm width traces to large conductive areas.
Standard materials
SSAIL technology works on standard dielectric materials: various polymers, glass, silicon, ceramics.
No metal additives are needed.
Materials tested:
| PC/ABS | PPS | Genitax |
| PA6 | PF | FR-4 |
| PVC | PI | Epoxy |
| PMMA | PC/ ABS for 3D printing | RO3003TM Laminates |
| PET | PTFE | SITAL ceramic |
| PEEK | ABF | AL2O3 ceramic |
| PPA | PA4 | Glass (soda lime) |
| LCP | PBS | Fused Silica |
| PBT | PREP 200 | Silicon |
High adhesion strength
Conductive traces formed with SSAIL technology has a high adhesion strength and environmental resistance.
This allows using it on flexible materials as well as in real-world environments.
| No: | Material | Adhesion strength |
|---|---|---|
| 1 | PEEK | 3610 N/cm2 |
| 2 | LCP | 1630 N/cm2 |
| 3 | Glass | 2720 N/cm2 |
| 4 | Sital ceramic | 730 N/cm2 |
| 5 | PET | 680N/cm2 |
| 6 | PMMA | 1030 N/cm2 |
| 7 | PC/ABS | 690 N/cm2 |