How does it work?

SSAIL is a two-step process:
1. Surface of the part is activated by laser
2. Chemical activation
2.1. Electrochemical plating
2.2. Standard chemical electroplating process

Flexibility of shapes

SSAIL technology enables forming conductive traces on different form factors:
– 3D surfaces
– Thin films
– Flexible materials
– Transparent materials
– From 1μm width traces to large conductive areas.


Standard materials

SSAIL technology works on standard dielectric materials: various polymers, glass, silicon, ceramics.
No metal additives are needed.

Materials tested:

PC/ABS PPS Genitax
PVC PI Epoxy
PMMA PC/ ABS for 3D printing RO3003TM Laminates
PEEK ABF AL2O3 ceramic
PPA PA4 Glass (soda lime)
LCP PBS Fused Silica
PBT PREP 200 Silicon


High adhesion strength

Conductive traces formed with SSAIL technology has a high adhesion strength and environmental resistance.
This allows using it on flexible materials as well as in real-world environments.

No: Material Adhesion strength
1 PEEK 3610 N/cm2
2 LCP 1630 N/cm2
3 Glass 2720 N/cm2
4 Sital ceramic 730 N/cm2
5 PET 680N/cm2
6 PMMA 1030 N/cm2
7 PC/ABS 690 N/cm2