ELAS Ventu – new silicon wafer cutting system designed for industrial use at “Vilniaus Ventos Puslaidininkiai”.
After six months of hard work a new micromachining system was created. Now it is being successfully used at “Vilniaus Ventos puslaidininkiai” for small batch production.
Ventu has many innovations:
- Single camera auto alignment and focusing system;
- Improved silicon cutting speed;
- Increased silicon cutting depth (up to 1200 μm);
- Easy to use touch screen control.
ELAS Ventu improvements allow more silicon wafers to be cut out in shorter time. This way company can save a lot of time and money. Read more: “Verso Zinios” article