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2012 July 18

2012 July 18


ELAS Ventu – new silicon wafer cutting system designed for industrial use at “Vilniaus Ventos Puslaidininkiai”.

After six months of hard work a new micromachining system was created. Now it is being successfully used at “Vilniaus Ventos puslaidininkiai” for small batch production.

Ventu has many innovations:

  • Single camera auto alignment and focusing system;
  • Improved silicon cutting speed;
  • Increased silicon cutting depth (up to 1200 μm);
  • Easy to use touch screen control.

ELAS Ventu improvements allow more silicon wafers to be cut out in shorter time. This way company can save a lot of time and money. Read more: “Verso Zinios” article