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MASTER 1

MASTER 1

MASTER 1

MASTER 1 laser micro-machining workstation is a perfect tool for scribing of sapphire wafers. Optimized micromachining parameters such as pulse energy, pulse energy density, focusing conditions, etc. allows to achieve high quality scribing line and to increase the process speed.

FEATURES:

  • Easy breaking, edge right angle
  • 300 mm/sec scribing speed
  • Tracking surface position during scribing
  • Beam focus adjustment
  • Beam power (pulse energy) control
  • Robotic wafer loading/unloading

Applications

Parameters
Laser type DPSS picosecond laser DPSS femtosecond laser
Wavelength 1064 nm 1030 nm
Max. average power 6 W 4 W
Pulse duration < 10 ps < 290 fs
Processing range XY: 300 x 300 mm XY: 300 x 300 mm
Scribing speed Up to 300 mm / s Up to 300 mm / s
Wafer size 2, 4, 6 inch wafers 2, 4, 6 inch wafers

2nd June 2017