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Silicon, glass and sapphire wafers cutting and scribing

Silicon, glass and sapphire wafers cutting and scribing

The use of laser technology for the manufacture of photonics components is a very important achievement. One of these areas is the dicing of the light-emitting diodes grown on sapphire substrate for further singulation. However, sapphire is mechanically and chemically difficult to machine because of its high hardness and chemical stability.

Laser processing is a potential machining method of sapphire. Elas patented invention relates to cutting of transparent materials based on the use of radiation of an ultrashort pulse laser with two wavelengths and their temporal and/or spatial alignment. Optimized micromachining parameters such as pulse energy, pulse energy density, the distance between pulses, focusing conditions, etc. allowed to achieve high quality scribing line and to increase the process speed.